Thermal Grizzly Putty Pro 100g Thermal Interface Material
Thermal Grizzly Putty Pro, 100g, 3x Spatulas, Good Thermal Conductivity, Replaces Thermal Pads
Email me when the availability or price changes
Finance this product
- Spend over £390.00 and Buy Now, Pay Later or spread the cost of your finance over 24-48 months with a 10% deposit.
- SCANPROTECT Protect against installation damage for 28 days.
Frequently Bought Together
Thermal Grizzly - TG Putty (Advanced)
TG Putty is a non-conductive electrical substitute for traditional thermal pads. This flexible and simple-to-apply gap filler is perfect for replacing GPU thermal pads because it evens out height variations. Usually, graphics cards come with a variety of thermal pad types that vary in thickness from the factory. When the cooler is replaced or converted to a GPU water cooler, different pads are needed.
TG Putty can be applied by hand (gloves are advised) or with the spatulas that are included. Broad application is possible with the spatula, and it can be manually formed into tiny pellets that are suited to the surface size (e.g., VRAM, SMD). TG Putty can fill height differences ranging from 0.2 to 3.0 mm.
TG Putty is available in three variants, primarily differing in their thermal conductivity:
TG Putty Basic: Medium thermal conductivity
TG Putty Advance: Good thermal conductivity
TG Putty Pro: Excellent thermal conductivity
Thermal Grizzly State:
For modifying a single, smaller graphics card without an active backplate (e.g., GeForce GTX 1060), approximately one 30-gram container of TG Putty is required. For larger graphics cards, such as a GeForce RTX 4090, one 30-gram container is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the backside, there is often a uniform, larger gap between the PCB and the backplate on larger graphics cards. In this case, approximately two 30-gram containers are needed to completely fill this gap.
Notes:
TG Putty is not suitable for use on processors (IHS or Direct Die) or directly on the GPU die!
Before application, the target surface should be thoroughly cleaned and degreased, for example, using TG Cleaning Wipes or conventional isopropanol.
Features
• Excellent Thermal Conductivity: Offers top-tier thermal performance for high-performance systems.
• Flexible Gap Filling: Adapts to height differences from 0.2 mm to 3.0 mm.
• Electrically Non-Conductive: Safe to use on sensitive GPU components without risk of short circuits.
• Easy Application: Can be applied using included spatulas or by hand (gloves recommended).
• Replaces Multiple Thermal Pads: Eliminates the need for various thickness thermal pads on graphics cards.
• 100g Container: Sufficient quantity for multiple GPU applications.
• Sticky Texture: Adheres well to surfaces but may be slightly harder to remove compared to higher tiers.
• Compatible with Various Components: Can be used on VRAM, VRM, and other GPU parts (excluding CPU and GPU dies).
