Silverstone SST-NT09-115X Nitrogon Low profile CPU Cooler with 92mm PWM fan

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Silverstone Nitrogon Low Profile CPU Cooler, For LGA 1156/1155/1150/1151, 92mm PWM fan, 45mm tall, Extruded Alu fins

Scan code: LN69971 Manufacturer code: SST-NT09-115X Request call

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Product Overview SilverStone Technology’s Nitrogon NT09-115X is a slim profile CPU cooler designed for space limited applications that utilizes LGA 1156/1155/1150/1151 platforms. It has an extruded aluminum fins for excellent thermal conductive. In addition, NT09-115X is equipped with a custom PWM 92mm silent fan that is staggered against the aluminum fins for better airflow focus and enhanced heat dissipation. Measuring only 45mm tall, the NT09-115X is a premier choice for slim cases utilizing LGA 1156/1155/1150/1151 processors. Features • Supports Intel LGA1156/1155/1150/1151 processors.
• Designed for low profile systems at only 45mm tall.
• Custom quiet 92mm fan for excellent cooling and low noise.
• Extruded aluminum fins for good heat dissipation.
• Reinforced back plate design reduces motherboard bending to provide tighter CPU contact.

Specifications

Cooler Specifications
Edition	Nitrogon
Cooler Form Factor
Heatpipes
Cooler Features	Aluminium Fins
Socket Compatibility	1150 1151 1155 1156
Max. Cooling Capacity
Fan Specifications
Included Fan Configuaration	1 x 92mm
Fan Edition
PWM Fan	Yes
Fan Bearing Type
Fan Colour
LED Lighting Colour
Fan Connectors
Approx Fan Speed	550 - 2500 rpm
Adjustable Fan Speed Controller	No
Fan Airflow	10.34 - 47.0 CFM
Air Pressure	0.136 - 2.8 mm H2O
Sound Level (dB)	18.5 - 32.0 dB
Sound Level (Sone)
Materials
Fan Material
Heatsink Material	Aluminium
Dimensions & Weight
Fan Dimensions	92 x 92 x 25 mm
Heatsink Dimensions
Total Dimensions	96 x 45 x 96 mm (WxHxD)
Weight

TekSpek Guides

Intel Branding Part I
Date Issued: 1st Jul 2009

Intel’s been on a mission of late. That mission revolves around grouping and standardising key technologies under various banners that are designed to ensure hardware compatibility and consumer ease of use. We’ll take a closer look at three such technologies that fall under the headings of Centrino, Viiv, and vPro, respectively.

Intel Core 2 Duo (Conroe)
Date Issued: 20th Oct 2008

The purpose of this TekSpek is to delineate the publicly known features of Intel’s next generation desktop microarchitecture. Codenamed Conroe and officially titled Intel Core 2 Duo, it’s loosely based on the current mobile Yonah (Core Duo) underpinnings.

Chassis Airflow
Date Issued: 20th Oct 2008

The modern PC is potentially a mass of heat output and heat production hot spots. With CPUs rated at more than 100W of heat output, single graphics boards carrying similar ratings (and people want to run two!), multiple hard drives the norm, lots of memory and mainboards covered in heatpipes to combat toasty core logic and PWM circuits, a PC appreciably warming up a room when it’s working hard is no joke.

Overclocking
Date Issued: 20th Oct 2008

This TekSpek explains why you’d want to overclock your graphics board, the risks in doing so and how you can go about doing it.

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Date Issued: 14th Jun 2008

There’s been a lot of hype about Intel’s Core 2 recently, even since they launched Core in fact. Words like Conroe, Badaxe and Allendale have been flying around. The bottom line is that Core 2 is the name of Intel’s latest line of CPUs, based on a new micro-architecture, designed for speed and efficiency.

System Noise Reduction
Date Issued: 5th Mar 2007

Anybody who has been near their share of computer systems will appreciate that not all systems make the same amount of noise. There are a number of reasons for why this is so. Firstly, a computer makes noise for different reasons. Generally, anything mechanical is going to make noise.

Silverstone SST-NT09-115X Nitrogon Low profile CPU Cooler with 92mm PWM fan