Z790 AORUS PRO X Intel LGA 1700 ATX Motherboard from Gigabyte
Designed for Next GenX marks the next generation! Introducing the AORUS Z790 X Gen Motherboards, the most powerful platforms ever built for the latest generation of Intel® Core™ processors. It features a digital twin 18+1+2 phases VRM solution with P-PAK, which ensures stable and efficient power delivery for overclocking. It also supports dual channel DDR5 memory with XMP 3.0, which enables faster and more reliable performance. The motherboard has one PCIe 5.0 and four PCIe 4.0 x4 M.2 connectors, which provide fast and large storage capacity for games and applications. The motherboard also has an advanced thermal design with fully covered MOSFET heatsinks, a 8mm heatpipe, and a 7.5 W/mK thermal conductivity pad. It also has multiple display outputs, such as DP and HDMI, and various USB ports, including front USB-C 10Gb/s and rear USB-C 20Gb/s. Push the limits with Gigabyte
Intel Z790Chipset
LGA 1700CPU Socket
14th/13th & 12th Gen IntelCompatible CPU
ATXForm Factor
Robust Power Delivery
Power in NumbersThe Z790 AORUS PRO X motherboard is equipped with an all-digital power design to achieve peak performance of the next-gen processors while providing the best stability under heavy workloads.
18 VCORE PhasesTo unleash full potential of multi-core CPU performance
1 VCCGT Phasefor CPU integrated GPU performance
2 VCCAUX Phasesprovide stable power for CPU integrated PCIe & Memory controller
The Future of Memory
Best-in-class Compatibility AORUS is committed to enabling the unparalleled next-gen performance. That is why every Z790 AORUS PRO X motherboard is engineered with industry-leading technologies to achieve the best-in-class DDR5 performance on the market.
Efficient Thermal Solution
ALL OUT ThermalsEvery Z790 AORUS PRO X motherboard is armored with the most advanced, full metal thermal design. These solid heatsinks are forged to keep your system cool while running fast.
VRM Advanced Thermal ArmourHigh coverage MOSFETs and integrated molded heatsinks improve thermal efficiency by enhancing airflow and heat exchange.
4X Larger SurfaceThe surface area has been increased up to 4X larger compared to traditional heatsinks, resulting in improved heat dissipation from the MOSFETs.
One-piece ConstructionThe TRUE single-piece heatsink offers superior cooling performance; compared to competitors' multi-piece designs, thanks to its one-piece construction and larger surface area.
Multi-Cut DesignWith its Multi-Cut Design, this heatsink includes multiple channels and inlets to enhance airflow, resulting in improved heat transfer performance.
8mm Heatpipe8mm Mega-Heatpipe with refined manufacturing minimises the gap between the heatpipe and heatsink, ensuring efficient MOSFET heat transfer and enhancing thermal performance.
7W/mK Thermal PadOptimise hardware performance with Gigabytes' advanced 7W/mK thermal pad for efficient heat dissipation.
Efficient PCB Design
Xtra layers for excellent playersAs the very foundation of the motherboard, the PCB plays a subtle yet critical role in the capabilities. No gamer should overlook the details lie within the PCB layers.
8-Layer PCBEnables dense integration, signal quality, power integrity, and low EMI for high-performance systems.
2X Copper EnhancementEnhances system performance with improved heat dissipation, power handling, and seamless overclocking support.
56% Lower Dissipation FactorElevate signal integrity in high-frequency circuits with our pioneering technology, setting a new standard for high-speed electronic design.
Ultra-Durable Design
PCIe UD Slot XThe latest PCIe UD Slot X offers unprecedented strength, providing enhanced protection for your graphics card.
Memory UD Slot D5 The one-piece, stainless-steel shielding design reinforces the Memory Slots, and maximizies signal integrity and overclocking potential.
M.2 UD Slot PG5 The one-piece, stainless-steel shielding design reinforces the M.2 Slots, and maximizies signal integrity.
UD Power ConnectorThe unique design provides better conductivity for power and better dissipation for the heat generated from it.
Embrace Impeccable Versatility
Maximum ConnectivityEnable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, latest USB connections and latest WiFi 7 connectivity.
