Arctic TP-4 100x100 / 0.5mm Silicon Based Premium Performance Thermal Pad

Arctic TP-4 Premium Performance Thermal Pad

The ARCTIC TP-4 Thermal Pad provides reliable heat transfer between components and heatsinks while helping bridge gaps caused by uneven surfaces and varying chip heights. Made from an extremely soft silicone-based material, the TP-4 can conform to manufacturing tolerances and compress to up to 60% of its original thickness, helping minimise thermal resistance. Its electrically insulating and non-adhesive design makes it safe and easy to handle, while the flexible pad can be cut to size for use with a wide range of components, including RAM, chipsets, GPUs, consoles and laptops. Available in multiple thicknesses and sizes, the TP-4 can be selected to suit different cooling requirements and applications.

High Performance — Extremely Soft

The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.

Safe Application

Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.

Minimising Thermal Resistance

The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.

Bridging Uneven Surfaces

The ARCTIC TP-4 Thermal Pad conforms to varying chip heights, air gaps and uneven contact surfaces, helping maintain consistent contact between the component and heatsink. Its soft, flexible construction fills gaps effectively to provide reliable and efficient heat transfer across the contact area.

Available in Various Thicknesses and Sizes

Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.

Stackable Without Performance Loss

Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.

• High-performance 100x100 0.5mm silicone-based thermal pad.
• Extremely soft 50 Shore OO hardness.
• Designed to bridge air gaps and uneven surfaces.
• Conforms to varying chip heights and manufacturing tolerances.
• Compresses to up to 60% of its original thickness.
• Low interface resistance helps minimise thermal resistance.
• Electrically insulating and non-adhesive.
• Flexible and easy to cut to size.
• Suitable for RAM, chipsets, GPUs, consoles, laptops and more.
• Multiple thicknesses and sizes available.
• Stackable without performance loss.
• Vibration-dampening properties.
• Operating temperature range of -40°C to 200°C.
• UL 94 V-0 flammability rating.