Arctic TP-3 100x100 / 0.5mm Silicon Based Premium Performance Thermal Pad
Arctic TP-3 Thermal Pad, 100x100 / 0.5mm, Silicon-Based, Cuttable, Stackable, Non-Adhesive, Blue
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High Performance — Very Soft
Based on silicone and a special filler, TP-3 outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.
Minimization of Thermal Resistance
The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.
Versatile Applications
Heat-conducting, vibration-damping, mouldable, electrically insulating — safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets, and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards, and electronic devices in general.
Safe Handling
The ARCTIC TP-3 is electrically insulating, non-adhesive, and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.
Bridging Gaps
The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without stressing sensitive and protruding components.
Available in Different Thicknesses and Sizes
Our thermal pads are available in a choice of 0.5 mm, 1.0 mm, and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.
Stackable without Performance Loss
The ARCTIC TP-3 thermal pads can be stacked particularly well due to their softness and low Interfacial Contact Resistance. This allows for flexible adaptation to various application requirements and the bridging of different thicknesses without compromising the efficiency of heat transfer. In contrast, harder pads often lose performance when stacked.
• High-performance 100x100 0.5mm silicone-based thermal pad.
• Extremely soft 55 Shore OO hardness.
• Designed to bridge air gaps and uneven surfaces.
• Conforms to varying chip heights and manufacturing tolerances.
• Low Interfacial Contact Resistance helps minimise thermal resistance.
• Electrically insulating and non-adhesive.
• Flexible and easy to cut to size.
• Suitable for RAM, chipsets, GPUs, consoles, laptops and more.
• Multiple thicknesses and sizes available.
• Stackable without performance loss.
• Vibration-dampening properties.
• Operating temperature range of -40 to 150 °C.
• UL 94 V-0 flammability rating.
