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SilentiumPC Fera 5 Dual Fan CPU Cooler Intel/AMD

Scan code: LN116937 Manufacturer code: SPC304

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End Of Life

SilentiumPC Fera 5 Dual Fan CPU Cooler Intel/AMD

SilentiumPC Fera 5 Dual Fan CPU Cooler, 2x120mm FDB Fans, 9 Blade, PWM, Touch Heatpipes, 1800rpm, Intel/AMD
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Scan code: LN116937 Manufacturer code: SPC304

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SCANPROTECT Protect against installation damage for 28 days.

Fera 5 120x2 Intel/AMD 120mm CPU Cooler from SilentiumPC

ADD EXPERT COOLING TO YOUR RIG Fera 5 is a new SilentiumPC CPU cooler implementing Synergy Cooling technology. It’s an all-new, asymmetrical heatsink with densely packed fins, optimized heatsink base and four direct-touch heatpipes, combined with new Fluctus 120 PWM fan with improved bearing and excellent acoustics. In addition to single fan Fera 5, a twin fan Fera 5 Dual Fan model with 2× Fluctus 120 PWM fans is available. Fera 5 series coolers are covered by 6-year manufacturer warranty.

120mmForm Factor

Intel LGA Sockets115X/1200/1366/2011X/2066

AMD SocketsAM2/AM3/AM4/FM1/FM2/TR4/TRX4

Cooling at its Finest

High performance, long life Fluctus 120 PWM fanFluctus 120 PWM works best on dense heatsinks and water cooling radiators, where airflow is restricted. Uniquely profiled fan blades create high static pressure. New high endurance bearing ensures smooth, low noise operation with 100 000 h MTBF.

Never Worry about Noise

Excellent acousticsSerrated leading edges of fan blades contribute to noise reduction. This reduces prominent tonal noises and is at heart of our patent-pending psychoacoustic optimization.

Cooling when you Need it

Optional semi-passive modeFluctus fans stop at very low PWM duty cycle and start automatically with rising duty cycle. Enthusiasts can create an optional semi-passive operation mode by adjusting the fan speed control curve.

Consistently Smooth Airflow

Asymmetrical heatsinkHeatsink fins are asymmetrical and specially profiled for maximum performance and minimum noise. Install with the indicated airflow direction for best results.

Made for Modern CPUs

Direct touch heatpipesThe compact heatsink base provides the best contact with the surface of modern CPUs. Four heatpipes are in direct contact with the CPU to improve heat transfer.

Create your Dream Build

Easy mounting systemNew, universal mounting system improves contact pressure between heatsink base and the processor. It has fewer parts and is easier to install in any position. Included pictorial manual and video guides explain the installation step-by-step.

Assembly Made Easy

Pactum PT-3 thermal compoundBundled thermal paste has high thermal conductivity and low viscosity. Pactum PT-3 combines high performance with ease of application. Bundled amount is sufficient for more than 3 applications.

Buying Guide

Need help? Read our Air Cooling Buying Guide

Intel Branding Part I
Date Issued: 1st Jul 2009

Intel’s been on a mission of late. That mission revolves around grouping and standardising key technologies under various banners that are designed to ensure hardware compatibility and consumer ease of use. We’ll take a closer look at three such technologies that fall under the headings of Centrino, Viiv, and vPro, respectively.

Intel Core 2 Duo (Conroe)
Date Issued: 20th Oct 2008

The purpose of this TekSpek is to delineate the publicly known features of Intel’s next generation desktop microarchitecture. Codenamed Conroe and officially titled Intel Core 2 Duo, it’s loosely based on the current mobile Yonah (Core Duo) underpinnings.

AMD AM2
Date Issued: 20th Oct 2008

The purpose This TekSpek quickly and easily explains AMD’s new processor socket and related technology to the reader, comparing it to AMD’s previous socket types.

AMD 64 Processors
Date Issued: 20th Oct 2008

This TekSpek explains what AMD’s AMD64 CPU instruction set architecture (ISA) is, shows what CPUs implement it from both AMD and Intel, and explains what software is available to run on those 64-bit consumer processors.

Chassis Airflow
Date Issued: 20th Oct 2008

The modern PC is potentially a mass of heat output and heat production hot spots. With CPUs rated at more than 100W of heat output, single graphics boards carrying similar ratings (and people want to run two!), multiple hard drives the norm, lots of memory and mainboards covered in heatpipes to combat toasty core logic and PWM circuits, a PC appreciably warming up a room when it’s working hard is no joke.

Overclocking
Date Issued: 20th Oct 2008

This TekSpek explains why you’d want to overclock your graphics board, the risks in doing so and how you can go about doing it.

Core 2
Date Issued: 14th Jun 2008

There’s been a lot of hype about Intel’s Core 2 recently, even since they launched Core in fact. Words like Conroe, Badaxe and Allendale have been flying around. The bottom line is that Core 2 is the name of Intel’s latest line of CPUs, based on a new micro-architecture, designed for speed and efficiency.

System Noise Reduction
Date Issued: 5th Mar 2007

Anybody who has been near their share of computer systems will appreciate that not all systems make the same amount of noise. There are a number of reasons for why this is so. Firstly, a computer makes noise for different reasons. Generally, anything mechanical is going to make noise.