Intel 128 Core Xeon 6980P Granite Rapids Server CPU/Processor

Intel® Xeon® 6980P Processor

The Intel® Xeon® 6980P processor is a server-grade CPU engineered for enterprise, cloud, and high-performance workloads. Built on Intel’s Intel 3 lithography (5 nm-class), this 128-core, 256-thread processor delivers a base frequency of 2.0 GHz and can reach up to 3.9 GHz with Intel® Turbo Boost Technology. The Xeon® 6980P features 504 MB of L3 cache and supports DDR5 memory at speeds up to 6400 MT/s, with MRDIMM support up to 8800 MT/s and a maximum memory capacity of 3 TB across 12 memory channels. With a 500 W TDP and optimized for dual-socket (2S) configurations, it provides sustained performance for compute-intensive enterprise and HPC workloads. The processor includes advanced technologies such as Intel® Speed Select Technology, Intel® Advanced Matrix Extensions (AMX), Intel® DL Boost, and supports up to 96 PCIe 5.0 lanes, making it ideal for high-bandwidth I/O, accelerators, storage, and networking. Its maximum operating temperature (DTS Max) is 95 °C, with a TCASE of 80 °C, ensuring reliable operation under demanding workloads.

Intel Xeon 6 Processors with Performance-Cores (P-cores)

Intel Xeon 6 processors with P-cores deliver higher performance per core, scaling up to hundreds of cores with advanced AI acceleration in every core. The Xeon 6 P-core family excels across compute-intensive workloads such as AI inference, machine learning, HPC simulations, and transactional databases. With enhanced memory bandwidth, high core counts, and large cache capacities, these processors outperform general-purpose CPUs for demanding server and cloud deployments. Dual-socket (2S) scalability allows data centers to expand throughput while maintaining high efficiency across threads.

• Cores and Threads: 128 cores, 256 threads
• Base Frequency: 2.0 GHz
• Max Turbo Frequency: 3.9 GHz
• All Core Turbo Frequency: 3.2 GHz
• Cache: 504 MB L3
• Memory Support: DDR5 up to 6400 MT/s, MRDIMM up to 8800 MT/s, max memory size 3 TB
• Memory Channels: 12
• Scalability: Dual-socket (2S) configuration
• PCIe Lanes: Up to 96 PCIe 5.0 lanes
• TDP: 500 W
• Lithography: Intel 3 (5nm-class)
• Socket: FCLGA7529
• Max Operating Temperature (DTS Max): 95°C