Intel 32 Core Xeon 6736P Granite Rapids Server CPU/Processor

Intel® Xeon® 6736P processor

The Intel® Xeon® 6736P processor is a high-performance server-grade CPU designed for demanding data center and enterprise workloads. Built on Intel's advanced 3 lithography (5nm-class), this 36-core, 72-thread processor boasts a base frequency of 2 GHz and can reach up to 4.1 GHz with Intel® Turbo Boost Technology. The Xeon® 6736P features a massive 144 MB of L3 cache and supports DDR5 memory at speeds up to 6400 MT/s, with a maximum memory capacity of 4 TB. With a TDP of 205W and optimized for dual-socket (2S) configurations, it offers excellent scalability and performance. The processor includes advanced technologies such as Intel® Speed Select Technology and supports up to 88 PCIe 5.0 lanes, making it ideal for a wide range of applications including virtualization, AI inference, and high-performance computing. Its maximum operating temperature (DTS Max) is 98°C, ensuring reliability in intensive computing environments.

Intel Xeon 6 processors with Performance-cores (P-cores)

Intel Xeon 6 processors with P-cores are optimised for high performance per core. With more cores, double the memory bandwidth, and AI acceleration in every core, Intel Xeon 6 processors with P-cores provide twice the performance for the widest range of workloads, including AI and HPC.1,2 Intel Xeon 6 processors with P-cores excel at a wide range of workloads, delivering better performance than any other general-purpose CPU for compute-intensive workloads like AI inference and machine learning (ML). Intel Xeon 6 processors with P-cores are great for public cloud workloads because they offer improved performance per vCPU for floating point operations, transactional databases, and HPC workloads.

• Cores and Threads: 36 cores, 72 threads
• Base Frequency: 2.0 GHz
• Max Turbo Frequency: 4.1 GHz
• All Core Turbo Frequency: 3.4 GHz
• Cache: 144 MB L3
• Memory Support: DDR5 up to 6400 MT/s, max memory size 4 TB
• Memory Channels: 8
• Scalability: Dual-socket (2S) configuration
• PCIe Lanes: Up to 88 PCIe 5.0 lanes
• TDP: 205 W
• UPI Links: 4 x 24 GT/s
• Lithography: Intel 3 (5nm-class)
• Socket: FCLGA4710
• Max Operating Temperature (DTS Max): 98°C