Scan code: LN33907 Manufacturer code: AK-CCE-7106HP

Akasa AK-CCE-7106HP Intel Aluminium/Copper CPU Cooler for S775/1155/1156 Low Profile

Akasa Low Profile Low Noise Copper Core Heat Sink Fan for Micro/mini ITX/HTPC Intel S775/1150/1151/1155/1156

Scan code: LN33907 Manufacturer code: AK-CCE-7106HP

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£9.98

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By DPD On 24th May 2018 to your specified address. | £5.48 Receive SMS with one-hour delivery window Weekend, timed and European delivery options are available at checkout

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ScanProtect

SCANPROTECT Protect against installation damage for 28 days. More info

ScanProtect is an enhanced warranty specifically designed and offered by Scan to reduce the risk of any mishap or damage to components during installation.

Our aim with ScanProtect is to encourage our customers to upgrade or build their own PC confidently. For a small additional fee our customers are provided with complete peace of mind.

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Frequently Bought Together

LN33907 Akasa AK-CCE-7106HP Intel Aluminium/Copper CPU Cooler for S775/1155/1156 Low Profile £9.98
LN38008 Akasa Crypto Mini ITX Case £69.98
Total Price:

Product Overview Ultra compact and low noise cooler for Intel Core 2 Duo, Core i3 and Core i5 (73W) CPU’s. The low profile design with embedded S-Flow fan makes it a perfect solution for mini-ITX, HTPC and SFF systems.

Aluminium heatsink with full height copper core and quiet HDB bearing fan ensure high efficiency and long life. High engineered multi directional aluminium heatsink maximizes heat dissipation and PWM fan provides optimal CPU, motherboard and VRM cooling with minimal noise levels.

Intel approved pushpins ensure easy installation, reliable retention and maximum compatibility on LGA775 and LGA1150/51/55/56 platforms without any mounting adjustment, pushpins will automatically slide into correct position. AK-CCE-7106HP is designed to work with CPU’s up to 73W but greater cooling efficiency can be attained with efficient case airflow. Pre-applied high performance thermal compound ensures clean and easy installation. Features • Hi-engineered aluminium heatsink with large full height copper core
• Multi-directional fins for maximum system cooling
• Embedded 8cm PWM fan with S-Flow blades and long life HDB bearing
• Intel approved push pins provide maximum compatibility
• Dual mounting for Intel LGA775 and LGA1150/51/55/56 platforms
• High performance thermal interface is pre-applied
• Total height of less than 30mm

Specifications

Cooler Specifications
Edition
Cooler Form Factor
Heatpipes
Cooler Features
Socket Compatibility	1150 1151 1156 775
Max. Recommended TDP
Max. Cooling Capacity
Fan Specifications
Included Fan Configuaration
Fan Edition
PWM Fan	No
Fan Bearing Type
Fan Colour
LED Lighting
Fan/Pump Connectors
Approx Fan Speed	600 ~ 3000 rpm
Manual Fan Speed Controller	No
Fan Airflow	33.5 CFM
Air Pressure
Sound Level (dB)	18.9 ~ 31.9 dB
Sound Level (Sone)
Materials
Fan Material
Cooler Material	Aluminium / Copper
Included TIM (Thermal Interface Material)
Dimensions & Weight
Fan Dimensions	74 x 74 x 15 mm
Heatsink/Radiator Dimensions	87.2 x 29.5 x 85.2 mm (WxHxD)
Total Dimensions
Weight

TekSpek Guides

Intel Branding Part I
Date Issued: 1st Jul 2009

Intel’s been on a mission of late. That mission revolves around grouping and standardising key technologies under various banners that are designed to ensure hardware compatibility and consumer ease of use. We’ll take a closer look at three such technologies that fall under the headings of Centrino, Viiv, and vPro, respectively.

Intel Core 2 Duo (Conroe)
Date Issued: 20th Oct 2008

The purpose of this TekSpek is to delineate the publicly known features of Intel’s next generation desktop microarchitecture. Codenamed Conroe and officially titled Intel Core 2 Duo, it’s loosely based on the current mobile Yonah (Core Duo) underpinnings.

Chassis Airflow
Date Issued: 20th Oct 2008

The modern PC is potentially a mass of heat output and heat production hot spots. With CPUs rated at more than 100W of heat output, single graphics boards carrying similar ratings (and people want to run two!), multiple hard drives the norm, lots of memory and mainboards covered in heatpipes to combat toasty core logic and PWM circuits, a PC appreciably warming up a room when it’s working hard is no joke.

Overclocking
Date Issued: 20th Oct 2008

This TekSpek explains why you’d want to overclock your graphics board, the risks in doing so and how you can go about doing it.

Core 2
Date Issued: 14th Jun 2008

There’s been a lot of hype about Intel’s Core 2 recently, even since they launched Core in fact. Words like Conroe, Badaxe and Allendale have been flying around. The bottom line is that Core 2 is the name of Intel’s latest line of CPUs, based on a new micro-architecture, designed for speed and efficiency.

System Noise Reduction
Date Issued: 5th Mar 2007

Anybody who has been near their share of computer systems will appreciate that not all systems make the same amount of noise. There are a number of reasons for why this is so. Firstly, a computer makes noise for different reasons. Generally, anything mechanical is going to make noise.