Heatsink Body Axis Displacement, no Interference with PCIE Slot 1 and RAM Slots on ATX or Micro ATX Boards.Aerodynamic Fin Design
HR Series Patent Through Holes, with Advanced Radial Alignment, for enhanced directed airflow and extra Heat Dissipation Surface Area.Airflow Tunnel
Proprietary Airflow Tunnel add-on kit for a 5-10% performance increase in Passive Cooling mode.Area of Effect XL
40% Larger Heat Dissipation Surface Area than it's predecessor, and largest Heat Dissipation Surface Area to date among Thermalright Heatsinks.8X Premium Copper Heatpipes
Eight 6mm Fully Sintered Copper Heatpipes, ideal for high TDP cooling usage.