EK-SF3D Inflection Point EVO - Mounting LGA-2011

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EK-SF3D Inflection Point EVO - Mounting Mechanism for LGA-2011 CPU Evaporation Cooler

Scan code: LN51691 Manufacturer code: 3831109857243 Request call

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Delivery options £5.48 By DPD On 27th Apr 2018 DPD Delivered to your specified address. Receive SMS with one-hour delivery window. £4.79 Collect from local shops UPS and DPD Pickup Collect your parcel from your newsagents, petrol stations and convenience stores. Free Collect Instore Q-Collect Place your order online and collect from our Bolton store with Q-Collect. Weekend, timed and European delivery options are available at checkout ScanProtect protection ScanProtect Protect against installation damage for 28 days.More

Product Overview EK-SF3D Inflection Point EVO - Mounting LGA-2011 is a LGA-2011 socket mounting mechanism for EK-SF3D Inflection Point EVO CPU evaporation cooler. This item allows the EK-SF3D Inflection Point EVO to be used on majority of Intel LGA-2011 socket based overclocking motherboards. Features • Material: Acetal.

Specifications

Cooler Specifications
Edition
Cooler Form Factor
Heatpipes
Cooler Features
Socket Compatibility	2011
Max. Recommended TDP
Max. Cooling Capacity
Fan Specifications
Included Fan Configuaration
Fan Edition
PWM Fan	No
Fan Bearing Type
Fan Colour
LED Lighting
Fan/Pump Connectors
Approx Fan Speed	N/A
Manual Fan Speed Controller	No
Fan Airflow
Air Pressure
Sound Level (dB)
Sound Level (Sone)
Materials
Fan Material
Cooler Material	Acetal
Included TIM (Thermal Interface Material)
Dimensions & Weight
Fan Dimensions
Heatsink/Radiator Dimensions
Total Dimensions
Weight

TekSpek Guides

Intel Branding Part I
Date Issued: 1st Jul 2009

Intel’s been on a mission of late. That mission revolves around grouping and standardising key technologies under various banners that are designed to ensure hardware compatibility and consumer ease of use. We’ll take a closer look at three such technologies that fall under the headings of Centrino, Viiv, and vPro, respectively.

Intel Core 2 Duo (Conroe)
Date Issued: 20th Oct 2008

The purpose of this TekSpek is to delineate the publicly known features of Intel’s next generation desktop microarchitecture. Codenamed Conroe and officially titled Intel Core 2 Duo, it’s loosely based on the current mobile Yonah (Core Duo) underpinnings.

Chassis Airflow
Date Issued: 20th Oct 2008

The modern PC is potentially a mass of heat output and heat production hot spots. With CPUs rated at more than 100W of heat output, single graphics boards carrying similar ratings (and people want to run two!), multiple hard drives the norm, lots of memory and mainboards covered in heatpipes to combat toasty core logic and PWM circuits, a PC appreciably warming up a room when it’s working hard is no joke.

Overclocking
Date Issued: 20th Oct 2008

This TekSpek explains why you’d want to overclock your graphics board, the risks in doing so and how you can go about doing it.

Core 2
Date Issued: 14th Jun 2008

There’s been a lot of hype about Intel’s Core 2 recently, even since they launched Core in fact. Words like Conroe, Badaxe and Allendale have been flying around. The bottom line is that Core 2 is the name of Intel’s latest line of CPUs, based on a new micro-architecture, designed for speed and efficiency.

System Noise Reduction
Date Issued: 5th Mar 2007

Anybody who has been near their share of computer systems will appreciate that not all systems make the same amount of noise. There are a number of reasons for why this is so. Firstly, a computer makes noise for different reasons. Generally, anything mechanical is going to make noise.

EK-SF3D Inflection Point EVO - Mounting LGA-2011