End Of Life

Antec Formula 7 Thermal Compound for CPU

Antec Formula 7 Thermal Compound Diamond Particle based - Hi-End!

Antec
Scan code: LN36256 Manufacturer code: 0-761345-77061-3 Request call
End Of Life
High End
Product Overview Antec's Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders.

Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat.

Formula 7's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C.

To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 7 for a diamond-caliber solution. Features • Diamond particles measuring 0.0000015cm rated at 8.3 w/mK
• Extended -50°C to 250°C stable temperature range ideal for performance cooling
• Lighter, easier to spread stable composition, won’t crack or dry out
• Quantity: 4 g
• Specific gravity: 2.8 g/cm3
Warranty

Please note your statutory rights are not affected.

For further information regarding Scan's warranty procedure please see our terms and conditions

Details
Duration:
1 months
Type:
Return to base
DOA Period:
1 days
Manufacturer Contact Details
Manufacturer:
Non-Returnable Item if Opened or Used
Telephone:
0871 472 4747
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Reviews
Antec Formula 7 Thermal Compound Diamond Particle based - Hi-End! is rated 5.0 out of 5 by 1.
Rated 5 out of 5 by from Very decent compound, if a little thick I have always been very focused when it comes to my CPU's cooling and so have tried various different thermal compounds and so seeing this compound appear caught my eye. This compound is very thick/stiff and so spreading was not really an option. Seeing as I use the pea/bb application method, the thick consistency didn't really pose an issue. On first glance my temps are around 2 degrees lower than what they were with arctic cooling mx2 (my now second choice of compound) I would recommend this compound, however please be aware of how tough this stuff is to spread, even extracting the compound from the syringe was tougher than I expected.
Date published: 2013-12-25
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