Antec Formula 7 Thermal Compound for CPU

Antec Formula 7 Thermal Compound Diamond Particle based - Hi-End!

Antec
Scan code: LN36256 Manufacturer code: 0-761345-77061-3 Request call
£8.99
In stock
Buy Now, Pay Later with a 10% deposit. Or spread the cost of your finance over 24-48 months.
High End
Delivery options £5.48 By DPD On 6th Dec 2016 DPD Delivered to your specified address. Receive SMS with one-hour delivery window. £4.79 Collect from local shops UPS and DPD Pickup Collect your parcel from your newsagents, petrol stations and convenience stores. Free Collect Instore Q-Collect Place your order online and collect from our Bolton store with Q-Collect. Weekend, timed and European delivery options are available at checkout Scansure protection Scansure Protect against installation damage for 28 days.More
Frequently Bought Together
Product Overview Antec's Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders.

Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat.

Formula 7's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C.

To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 7 for a diamond-caliber solution. Features • Diamond particles measuring 0.0000015cm rated at 8.3 w/mK
• Extended -50°C to 250°C stable temperature range ideal for performance cooling
• Lighter, easier to spread stable composition, won’t crack or dry out
• Quantity: 4 g
• Specific gravity: 2.8 g/cm3
Warranty

Please note your statutory rights are not affected.

For further information regarding Scan's warranty procedure please see our terms and conditions

Details
Duration:
1 months
Type:
Return to base
DOA Period:
1 days
Manufacturer Contact Details
Manufacturer:
Non-Returnable Item if Opened or Used
Telephone:
0871 472 4747
TekSpek Guides
Chassis Airflow
Chassis Airflow
Date Issued: 20th Oct 2008

The modern PC is potentially a mass of heat output and heat production hot spots. With CPUs rated at more than 100W of heat output, single graphics boards carrying similar ratings (and people want to run two!), multiple hard drives the norm, lots of memory and mainboards covered in heatpipes to combat toasty core logic and PWM circuits, a PC appreciably warming up a room when it’s working hard is no joke.

Read More

Overclocking
Overclocking
Date Issued: 20th Oct 2008

This TekSpek explains why you’d want to overclock your graphics board, the risks in doing so and how you can go about doing it.

Read More

Watercooling
Watercooling
Date Issued: 19th Jun 2008

Watercooling for the PC has been around for years in some form or another, for at least as long as Scan have been in business, with basic physics defining why you want to use it. That means for air cooling, to cope with increasing temperature in the heatsink you need to move the air across it faster. That is why thermostatically controlled fans in your PC will turn faster the hotter something gets.

Read More

Reviews
Rated 5 out of 5 by 1 reviewer.
Rated 5 out of 5 Very decent compound, if a little thick I have always been very focused when it comes to my CPU's cooling and so have tried various different thermal compounds and so seeing this compound appear caught my eye. This compound is very thick/stiff and so spreading was not really an option. Seeing as I use the pea/bb application method, the thick consistency didn't really pose an issue. On first glance my temps are around 2 degrees lower than what they were with arctic cooling mx2 (my now second choice of compound) I would recommend this compound, however please be aware of how tough this stuff is to spread, even extracting the compound from the syringe was tougher than I expected. 25 December 2013
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