AMD 4344 Opteron Processor - 6 Core
AMD 3rd Gen. Opteron 4334 CPU, Seoul 6 Core, S C32 (LGA1207), 3.1GHz, 8MB L3 Cache, 95W, Retail, Without Fan/Heatsink
£199.99
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£5.48
By DPD On 22nd Sep 2017
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Product Overview
AMD Opteron™ 4300 Series Processors
Success in the cloud boils down to data center scalability and efficiency.
So our server processors are designed to be power-conscious with flexible compute resources designed to help your business scale seamlessly into demanding cloud environments.
Heatsink/Fan not included, sold separately. Features Performance
• Next generation modular core architecture - Optimized performance per watt: High frequency and low-power design, Virtualization enhancements, Shared double-sized Flex FP, IPC enhancements.
• Cache and Core Count - Integration of 6 cores within the same package, and shared 8MB L3 cache per socket.
• AMD Turbo CORE Technology - Turns unused TDP headroom into added clock speed for improved performance.
• Flex FP - The world's only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for dedicated 128-bit execution per core or shared 256-bit execution per module.
• High DDR3 Frequencies - DDR3-1866 MHz support.
AMDP2.0
• APML (Advanced Platform Management Link) - Provides an interface for processor and systems management monitoring and controlling of system resources (in APML-enabled platforms); Comprised of the Remote Power Management Interface (RPMI) and the Precision Thermal Monitor.
• TDP Power Cap - Allows the user to set the maximum processor power ceiling via BIOS or APML.
• AMD CoolSpeed Technology - Protects processor integrity by reducing power-states, when a temperature limit is reached.
• C1E - Reduces memory controller and HyperTransport™ technology links' power.
• C6 Support - Core power gating: When a core is halted its context is exported to system memory and voltage is removed from the core.
• LV-DDR3 - Support Supports 1.25V and 1.35V DDR3.
• Ultra-low Power Platform - Specialized ultra-low power platforms great for cloud/dense environments.
Direct Connect Architecture 2.0
• HyperTransport™ Technology Assist (HT Assist) - Helps to increase coherent memory bandwidth and reduce latency in multi-node systems by reducing cache probe traffic between cores.
• HyperTransport™ 3.0 Technology (HT3) - Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3.
Success in the cloud boils down to data center scalability and efficiency.
So our server processors are designed to be power-conscious with flexible compute resources designed to help your business scale seamlessly into demanding cloud environments.
Heatsink/Fan not included, sold separately. Features Performance
• Next generation modular core architecture - Optimized performance per watt: High frequency and low-power design, Virtualization enhancements, Shared double-sized Flex FP, IPC enhancements.
• Cache and Core Count - Integration of 6 cores within the same package, and shared 8MB L3 cache per socket.
• AMD Turbo CORE Technology - Turns unused TDP headroom into added clock speed for improved performance.
• Flex FP - The world's only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for dedicated 128-bit execution per core or shared 256-bit execution per module.
• High DDR3 Frequencies - DDR3-1866 MHz support.
AMDP2.0
• APML (Advanced Platform Management Link) - Provides an interface for processor and systems management monitoring and controlling of system resources (in APML-enabled platforms); Comprised of the Remote Power Management Interface (RPMI) and the Precision Thermal Monitor.
• TDP Power Cap - Allows the user to set the maximum processor power ceiling via BIOS or APML.
• AMD CoolSpeed Technology - Protects processor integrity by reducing power-states, when a temperature limit is reached.
• C1E - Reduces memory controller and HyperTransport™ technology links' power.
• C6 Support - Core power gating: When a core is halted its context is exported to system memory and voltage is removed from the core.
• LV-DDR3 - Support Supports 1.25V and 1.35V DDR3.
• Ultra-low Power Platform - Specialized ultra-low power platforms great for cloud/dense environments.
Direct Connect Architecture 2.0
• HyperTransport™ Technology Assist (HT Assist) - Helps to increase coherent memory bandwidth and reduce latency in multi-node systems by reducing cache probe traffic between cores.
• HyperTransport™ 3.0 Technology (HT3) - Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3.
AMD 4344 Opteron Processor - 6 Core
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