Phanteks PH-TC14_PE twin tower thermal radiator design uses the latest aerospace technology. By using P.A.T.S to increase cooling performance and C.P.S.C Technology to enhance thermal conductivity, heat will easily dissipate, creating an opportunity for greater overclocking. Combined with Dual Phanteks PH-F140 Premium 140mm Fans, easy-to-install SoliSku mounting kit and PH-NDC thermal compound, Phanteks PH-TC14 with unique colored is setting the new standard of today’s CPU cooling
• Patented. P.A.T.S (Physical Antioxidant Thermal Shield) will greatly increase the cooling performance and reliability while deflecting other thermal radiation from other heat sources, such as the GPU, South Bridge, North Bridge, etc. P.A.T.S, ran at a long period, will display significantly better results in an enclosure, closed environment, than a tech station, open environment. In extreme conditions, PATS is able to withstand temperatures of up to 200 degrees Celcius. P.A.T.S is environmental friendly and non-toxic.
• Patented. C.P.S.C (Cold Plasma Spraying Coating Technology) is a brand new technologic forming deposit that displaces heat onto corresponding metals at a quicker rate. With this technology, the Phanteks PH-TC14PE enhances thermal conductivity on the soldered surfaces of the heat-pipes through the copper deposits.
• Designed with dual tower radiators; the PH-TC14PE has five 8mm heat-pipes linearly aligned to ensure optimal cooling. This cooler is made to have the least amount of air and thermal resistance.
• Phanteks PH-F140 premium 140mm fans uses Updraft Floating Balance (U.F.B) bearing, nine Maelstrom Vortex Booster (M.V.B) blades, to achieve massive airflow and perfect dynamic balance. to reduce noise level, the fan emits a low dBA with the support of the acoustic rubber damper and rubber-bar to help eliminate vibration.
• The SoliSku universal mounting kit provides an easy-to-install rotational backplate for Intel LGA 2011/1155/1156/11366/775. AMD FM1/AM2/AM2+/AM3 (stock backplate required ).
• The PH-NDC is a superb quality thermal compound for heatsinks. It is made of high-purity nano diamond like particles to improve the thermal conductance between components. The generated heat caused by the CPU will transfer to the heatsink, without reduction in efficiency and resistance.
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