Coolermaster TPC 800 Cooler
Scan code: LN46990
Manufacturer code: RR-T800-FLNN-R1
End Of Life
Coolermaster TPC 800 Cooler
Cooler Master TPC-800 Universal High-End Gaming CPU Cooler Heatsink without Fan (Passive) without Fan
Scan code:
LN46990
Manufacturer code:
RR-T800-FLNN-R1
This product is no longer available to purchase.
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- 48HR REPLACEMENT If you need to return this item, your replacement will be dispatched within 2 working days of your product arriving back at Scan.
Product Overview
TPC 800 is the Cooler Master Reference Cooler for optimal Performance and is a high end cooling system with perfect performance for overclocking. TPC 800 is the first-ever CPU heatsink to use vertical vapor chamber technology and combine it with heatpipe technology: the synergy of both technologies working in tandem delivers the top cooling performance.
Socket 775/1150/1151/1155/1156/1366/2011/AM2/AM2+/AM3/FM1/FM2
Fans Can be Added - We Recommend the Cooler Master Sickleflow Fans
The TPC 800 is an overclockers heat sink that’s why it’s purely sold without any fans, a bit like if you were buying a radiator for a water cooling set-up, you choose the fans which are best suited to your needs.
Features • The TPC 800 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
• The first-ever CPU heatsink to use vertical vapor chamber technology.
• 100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
• Special fin design – heatsink receives concentrated cold airflow.
• Improved air pressure design and fan mounting system.
Socket 775/1150/1151/1155/1156/1366/2011/AM2/AM2+/AM3/FM1/FM2
Fans Can be Added - We Recommend the Cooler Master Sickleflow Fans
The TPC 800 is an overclockers heat sink that’s why it’s purely sold without any fans, a bit like if you were buying a radiator for a water cooling set-up, you choose the fans which are best suited to your needs.
Features • The TPC 800 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
• The first-ever CPU heatsink to use vertical vapor chamber technology.
• 100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
• Special fin design – heatsink receives concentrated cold airflow.
• Improved air pressure design and fan mounting system.