Antec Formula 6 Thermal Compound
Scan code: LN36255
Manufacturer code: 0-761345-77060-6
End Of Life
Product Overview
Antec’s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since
little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the
transfer of heat. Formula 6’s nano diamond particles minimize the distance between heat-conductive compounds
and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your
system cool and your CPU functioning comfortably, pick up Antec’s Formula 6 for a diamond-caliber solution. Features • Diamond particles measuring 0.0000015 cm rated at 5.3 w/mK
• Extended -30°C to 250°C stable temperature range ideal for Performance cooling.
• Lighter, easier to spread stable composition won’t crack or dry out
• Quantity: 4 g
• Specific gravity: 2.2 g / cm3
little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the
transfer of heat. Formula 6’s nano diamond particles minimize the distance between heat-conductive compounds
and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your
system cool and your CPU functioning comfortably, pick up Antec’s Formula 6 for a diamond-caliber solution. Features • Diamond particles measuring 0.0000015 cm rated at 5.3 w/mK
• Extended -30°C to 250°C stable temperature range ideal for Performance cooling.
• Lighter, easier to spread stable composition won’t crack or dry out
• Quantity: 4 g
• Specific gravity: 2.2 g / cm3