Kingston Memory HyperX Genesis Grey Dual Channel Kit 8GB (2x4GB) DDR3 PC3-12800 (1600)
Scan code: LN41764
Manufacturer code: KHX1600C9D3X2K2/8GX
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Kingston Memory HyperX Genesis Grey Dual Channel Kit 8GB (2x4GB) DDR3 PC3-12800 (1600)
8GB (2x4GB) Kingston DDR3 HyperX Genesis Grey, PC3-12800 (1600), Non-ECC Unbuffered, CAS 999-27, XMP, 1.65V
Scan code:
LN41764
Manufacturer code:
KHX1600C9D3X2K2/8GX
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Product Overview
Kingston's KHX1600C9D3X2K2/8GX is a kit of 2 x 4GB ) DDR3-1600 CL9 SDRAM 512M x 64-bit (Synchronous DRAM) 2Rx8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module.
Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Features • 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Features • 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component