Corsair Memory XMS3 2GB DDR3 1333 Mhz CAS 9 DHX Dual Channel Desktop
Scan code: LN18887
Manufacturer code: TWIN3X2048-1333C9DHX G
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Corsair Memory XMS3 2GB DDR3 1333 Mhz CAS 9 DHX Dual Channel Desktop
2GB (2x1GB) Corsair XMS3, DDR3 PC3-10666 (1333) Non-ECC Unbuffered, CAS 9-9-9-24, DHX, 1.5V
Scan code:
LN18887
Manufacturer code:
TWIN3X2048-1333C9DHX G
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Product Overview
This memory is certified for SLI use.
The Twin3X2048-1333C9DHX G is a 2048MByte matched pair of DDR3 SDRAM DIMMs built using Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This part delivers outstanding performance in the latest generation of dual-channel DDR3-based motherboards. It has been tested extensively in multiple DDR3 motherboards to ensure compatibility and performance at its rated speed. This memory has been verified to operate at 1333MHz at the low latencies of 9-9-9-24.
Features Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
Test Specs
• Each module pair is tested together at 1333MHz
• Tested and packaged in pairs - Packaged together immediately following system test
• Tested together at 1333MHz, Vdimm = 1.50V, at latency settings of 9-9-9-24
• SPD programmed at: JEDEC standard 9-9-9-24 values at 1333MHz
Features
• 2048 Megabytes of DDR3 memory
• Two matched CM2X1024-1333C9DHX G modules
• Unique DHX technology providing maximum cooling
• 100% tested at 1333MHz in high performance DDR3 motherboards
• Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
• Lifetime warranty
The Twin3X2048-1333C9DHX G is a 2048MByte matched pair of DDR3 SDRAM DIMMs built using Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This part delivers outstanding performance in the latest generation of dual-channel DDR3-based motherboards. It has been tested extensively in multiple DDR3 motherboards to ensure compatibility and performance at its rated speed. This memory has been verified to operate at 1333MHz at the low latencies of 9-9-9-24.
Features Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
Test Specs
• Each module pair is tested together at 1333MHz
• Tested and packaged in pairs - Packaged together immediately following system test
• Tested together at 1333MHz, Vdimm = 1.50V, at latency settings of 9-9-9-24
• SPD programmed at: JEDEC standard 9-9-9-24 values at 1333MHz
Features
• 2048 Megabytes of DDR3 memory
• Two matched CM2X1024-1333C9DHX G modules
• Unique DHX technology providing maximum cooling
• 100% tested at 1333MHz in high performance DDR3 motherboards
• Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
• Lifetime warranty